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0.8mm Pitch 4mm Mounting Height S.O. DIMM Socket
SX6E Series
SX6E-144S-0.8SH
sFeatures
1. 144pos. 8 Byte Small Outline DIMM
SX6E series is a 0.8mm pitch parallel SMT type socket applicable to 144pos. 8 Byte Small Outline DIMM standardized by JEDEC.
4mm Mounting Height, 69.6mm Width Socket
2. 4mm Mounting Height
This socket achieves 4mm mounting height and is designed in a small and light structure.
69.6
mm
3. 69.6mm Socket Width
This socket achieves 69.6mm width with mold latch and reduces the prohibition area to mount the mother board.
4mm
4. Easy Insertion and Extraction of Module Board
(1) One-touch operation to insert the module board slantly and push it downward. (2) Widen latches right and left, and the module board will be automatically raised.This mechanism allows easy automatic extraction. (3) The original mold twin-latch mechanism allows click sensible Insertion and extraction.
Easy Insertion and Extraction Operation of Module Board
5. Solder Reparability
Considering solder reparability, the contact SMT is designed so as to widen the insulation case interval.
sApplications
Note PC, business equipment, measuring instruments, telecommunication equipment, medical equipment, FA, game appliances, EWS
D24
sProduct Specifications
Current rating Rating Voltage rating Operating Temperature Range Item 1. Contact Resistance 2. Insulation Resistance 3. Withstanding voltage 4. Durability (Insertion/withdrawal) -55c+85c 25V AC 0.3A Condition 100mA DC 250V DC 250V AC / 1 minute 30 cycles Operating Humidity Range -55c to +85c
Specification 35m ohms min. 1000M ohms min. No flashover or insulation breakdown. Contact resistance: 55m ohms max. No damage, cracks, or parts looseness. No electrical discontinuity of 1s or more
5. Vibration
Contact resistance: 55m ohms max. No damage, cracks, or parts looseness. No electrical discontinuity of 1s or more
Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours in each of the 3 directions.
6. Shock
Contact resistance: 55m ohms max. No damage, cracks, or parts looseness. Contact resistance: 55m ohms max. Insulation resistance: 1000M ohms max. No damage, cracks, or parts looseness. Contact resistance: 55m ohms max. Insulation resistance: 1000M ohms max. No damage, cracks, or parts looseness. Contact resistance: 55m ohms max.
Acceleration of 490 m/s2, 11 ms duration, sine half-wave waveform, 3 cycles in each of the 3 axis
7. Temperature Cycle
5 cycles under following conditions: Temperature : -55 +5 to 35 +85 +5 to 35c Time : -30 10 to 15 +30 10 to 15 minutes
8. Humidity (Steady state) 9. Salt spray
96 hours at temperature of 40c and humidity of 90% to 95%
Exposed to density 5% salt water for 48 hours
sMaterial
Part Contact Insulator Metal fitting Material Phosphor copper LCP(UL94V-0) Phosphor copper Solder plating Finish Gold plating
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sSocket
SX6E-144S-0.8SH
(4) (4.8)
(30)
C L
(30
)
(69.6) (2.1)
(63)
Part Number SX6E-144S-0.8SH(20)
CL No. 530-0303-5-20
Number of Contacts 144
Key position Right, 4.8
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BPCB mounting pattern
SX6E-144S-0.8SH
60.60.03 32.80.03 O1.10.05 3.10.05 20.05 4.60.03 (2.5) No.143 0.50.03 No.1 23.20.03 10.03 CONNECTOR OUTER LINE O1.60.05
16.10.1
3.10.05
20.05
No.2 No.144 1.40.03 (2.1) 4.60.03
260.1
10.460.1 40.1
(4.8) 4.60.1 0.80.03 3.50.1 30.30.03 32.80.03 7.50.1 30.30.03 23.20.03
NO COMPONENT AREA
20
60.60.03 630.08
Module insertion direction
D27
BRecommended Module Board Dimensions
67.6 63.6 24.5 0.05
0.15
0.15
3.8MAX
R2 Mounting area
0.05
20 0.1
3.2MIN
3.3 0.05
2.5 0.02 4.6 0.03 A 23.2 0.03 32.8
0.03
B 1
0.1
R3MIN
6 0.08
O1.8
2.1 0.02 3.7 0.05 23.2 0.03 4.6 0.03 32.8 0.03
A (5 : 1) (4) R0.75
B (5 : 1)
(4.2)
4
(2.55)
0.1
0.1+0.15 _0.05
1.5 0.1
D28
25.4
0.6 0.05 0.8 0.03
0.15
Mounting area
4MIN
BPrecausions for use
Latch section Latch knob
Side notch
Latch claw Latch arm Polarizing key
Key
Procedures for Board Insertion
1. Adjust the socket polarizing key and the board key to the same direction. 2. Insert the board slantly. Moreover, lay the board in parallel to the opening at angle of 20 to 30 , and softly insert the board so as to hit the socket bottom. Stopping insertion halfway will result in improper insertion. 3. Applying the board side notch in parallel to the socket bottom so that the board position cannot be displaced, press the board side notch up, and fix the both socket edges to the latch area. Press the board side notch, and release the notch with a snap "click" tone, if the printed board passes through the latch claw head. 3. With this action, the board has been completely installed in the socket. At this time, pressing force is equivalent to the extent of turning on the electric product switch. If the stronger pressing force is needed, check whether the direction and depth to insert the board is adequate or not, and then re-push the board.
Procedures for Board Insertion
q
w
Procedures for Board Extraction
3. Apply the thumb nail to the latch knob at both socket edges. Forcibly widen the latch knobs to right and left ways, and release the latch. Then, draw the board out along the angle where the board is raised. Cautions
q The latch has strength enough to endure. However, if force is applied
according to other operation methods instead of the Procedures for Handling Sockets, or if further force is given in the state where the module board is raised, products could be damaged. Be sure to observe the Procedures for Handling Sockets.
e
q The board is designed in compliance with JEDEC "Small Outline DIMM (Dual
Inline Memory Module". However, if other boards are used instead of the recommended module board, or if the mounting product is used for other devices than DRAM memory IC, troubles due to vibration or other failures could occur. If needed, consult the HRS company.
q The recommended module board pad or sharp angle edges could cause failure
in contacts. Therefore, it is recommended to offset the tie-bar from the center line, set the internal pad, or remove sharp corners or burrs according to the recommended sizes.
q Don't provide the external contact surface of the module board with the
convex/concave and chamfer areas at both edges. Comply with the recommended sizes.
Procedures for Board Extraction
q When the board is mounted or housing is installed, if warpage or flexure has
occurred, an excessive load could cause changes in the solder bonding area and the strength. Be sure to check individual points.
q If the board is used under environments where corrosive gas is apt to occur,
consult the HRS company.
D29
BRecommended Temperature Profile
q IR Reflow: Recommended Temperature Profile (Up to second reflow) q Manual Soldering
Soldering iron temperature: 30010c Manual soldering time: 3 seconds max. Temperature (c)
(Time) Naturally exposed 250 240 220 200 180 150 140
235
5 seconds max.
Preheating, 80 seconds
Soldering, 30 seconds
qApplicable Conditions
Reflow system : IR reflow Solder : Paste type 63 Sn/37 Pb (Flux content 11 wt%) Test board Glass epoxy 110mm x 85mm x 1.6 mm Metal mask thickness: 0.15 mm Recommended temperature profile. The temperature may be slightly changed according to the solder paste type and amount.
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